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3D Solder Paste Inspection System

ItemNo: HC7    add to favorite   write reviews
【Application】 :
★.Measurement of paste thickness and shape
★. Measurement of bonded chips, part co-planarity, BGA/CSP size and shape.
★.Measurement of steel mesh’s and through hole’s size and shape  
★.Measurement of PCB pad and its pattern, screen-print’s thickness and shape
★.Measurement of IC package and blank PCB distortion
★.Other 3D measurement, inspection, analysis and solutions
1clickmachine@gmail.com oneclickmachine

3D Slder Paste Inspection System

1.      3D scan and measurement
2.      3D simulation of part reorganization
3.      Multi-zone PCB programming and scanning
4.      Automatic repeated measurement
5.      Large scan range along X and Y
6.      Software-calibrated Z-servo
7.      Automatic offset for bent PCB
8.      Five-position magnification selector
9.      Strong SPC function
10.    Product and production line management
11.    Automatic analysis and extraction of solder paste
12.    Humanized operation
Working Principle

Precise laser-line displacement       Full understanding of paste shape    Data acquisition by 3D scan

3D Demonstration

Work station
Max. PCB size to be measured: 390×300mm
Measurement mode
Measurement of single-point height
Measurement of a selected area’s average height
Scan range along X & Y: 390×300mm
Automatic measurement of 3D visual field
Work station of other sizes can be customized upon request
Automatic measurement of programmable and multi-zone 3D visual field
Measurement of programmable plane geometry
Light source for measurement
Precise red laser line with adjustable height
3D mode
3D simulated diagram
Light source for illumination
Highly bright white-light lamp ring with adjustable height
SPC mode
X-Bar R cart
Scan interval along X & Y
10um-50uM, adjustable
Histogram                                                       Ca/Cp/Cpk/Pp/Ppk
Scan speed
Data analysis, full SPC functions
Scan range
Adjustable, max. 390×300mm
Data export, pre-view and print
Movement speed along X & Y
Adjustable, max. 35mm/s
Analysis and management of product and production line
Height discrimination
Max. 1um
Other functions
Automatic Z-axis offset for bent PCB
Precision of repeated measurement
Software controlled offset for bent PCB
Magnification factor of lens
20X-110X, 5-position magnification selector
Measurement and management of product and production line
Data density
1,300,000 pixel / 1680*1024
Parameter calibration and password protection
Z-axis offset for bent PCB
Remembrance of checked box
Power source
110V60Hz/220V50Hz AC
PC and operating system
Dual core, high-speed CPU + independent display card         Windows XP
Automatic functions
Programmable, automatic repeated measurement
Indicators and buttons
Red, yellow and green indicators
One key only to setting interface
Emergency Stop button
Automatic measurement
Alarm buzzer

Software Interface

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Reviews for: (3D Solder Paste Inspection System )
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